Two-sided majorana fermion quantum computing devices fabricated with ion implant methods

ABSTRACT

A quantum computing device is fabricated by forming, on a superconductor layer, a first resist pattern defining a device region and a sensing region within the device region. The superconductor layer within the sensing region is removed, exposing a region of a first surface of an underlying semiconductor layer outside the device region. The exposed region of the semiconductor layer is implanted, forming an isolation region surrounding the device region. The sensing region and a portion of the device region of the superconductor layer are exposed. A sensing region contact is formed by coupling the first surface of the semiconductor layer with a first metal layer. A nanorod contact using the first metal within the portion of the device region outside the sensing region is formed. By depositing a second metal layer on a second surface of the semiconductor layer within the sensing region, a tunnel junction gate is formed.

TECHNICAL FIELD

The present invention relates generally to a superconductor device, afabrication method, and fabrication system for superconducting quantumdevices. More particularly, the present invention relates to a device,method, and system for two-sided Majorana fermion quantum computingdevices fabricated with ion implant methods.

BACKGROUND

Hereinafter, a “Q” prefix in a word or phrase is indicative of areference of that word or phrase in a quantum computing context unlessexpressly distinguished where used.

Molecules and subatomic particles follow the laws of quantum mechanics,a branch of physics that explores how the physical world works at afundamental level. At this level, particles behave in strange ways,taking on more than one state at the same time, and interacting withother particles that are very far away. Quantum computing harnessesthese quantum phenomena to process information.

The computers we use today are known as classical computers (alsoreferred to herein as “conventional” computers or conventional nodes, or“CN”). A conventional computer uses a conventional processor fabricatedusing semiconductor materials and technology, a semiconductor memory,and a magnetic or solid-state storage device, in what is known as a VonNeumann architecture. Particularly, the processors in conventionalcomputers are binary processors, i.e., operating on binary datarepresented in 1 and 0.

A quantum processor (q-processor) uses the odd nature of entangled qubitdevices (compactly referred to herein as “qubit,” plural “qubits”) toperform computational tasks. In the particular realms where quantummechanics operates, particles of matter can exist in multiplestates—such as an “on” state, an “off” state, and both “on” and “off”states simultaneously. Where binary computing using semiconductorprocessors is limited to using just the on and off states (equivalent to1 and 0 in binary code), a quantum processor harnesses these quantumstates of matter to output signals that are usable in data computing.

Conventional computers encode information in bits. Each bit can take thevalue of 1 or 0. These 1s and 0s act as on/off switches that ultimatelydrive computer functions. Quantum computers, on the other hand, arebased on qubits, which operate according to two key principles ofquantum physics: superposition and entanglement. Superposition meansthat each qubit can represent both a 1 and a 0 at the same time.Entanglement means that qubits in a superposition can be correlated witheach other in a non-classical way; that is, the state of one (whether itis a 1 or a 0 or both) can depend on the state of another, and thatthere is more information that can be ascertained about the two qubitswhen they are entangled than when they are treated individually.

Using these two principles, qubits operate as more sophisticatedprocessors of information, enabling quantum computers to function inways that allow them to solve difficult problems that are intractableusing conventional computers. IBM has successfully constructed anddemonstrated the operability of a quantum processor usingsuperconducting qubits (IBM is a registered trademark of InternationalBusiness Machines corporation in the United States and in othercountries.)

In a superconducting state, the material firstly offers no resistance tothe passage of electrical current. When resistance falls to zero, acurrent can circulate inside the material without any dissipation ofenergy. Secondly, the material exhibits the Meissner effect, i.e.,provided they are sufficiently weak, external magnetic fields do notpenetrate the superconductor, but remain at its surface. When one orboth of these properties are no longer exhibited by the material, thematerial is said to be in a normal state and no longer superconducting.

A critical temperature of a superconducting material is a temperature atwhich the material begins to exhibit characteristics ofsuperconductivity. Superconducting materials exhibit very low or zeroresistivity to the flow of current. A critical field is the highestmagnetic field, for a given temperature, under which a material remainssuperconducting.

Superconductors are generally classified into one of two types. Type Isuperconductors exhibit a single transition at the critical field. TypeI superconductors transition from a non-superconducting state to asuperconducting state when the critical field is reached. Type IIsuperconductors include two critical fields and two transitions. At orbelow the lower critical field, type II superconductors exhibit asuperconducting state. Above the upper critical field, type IIsuperconductors exhibit no properties of superconductivity. Between theupper critical field and the lower critical field, type IIsuperconductors exhibit a mixed state. In a mixed state, type IIsuperconductors exhibit an incomplete Meissner effect, i.e., penetrationof external magnetic fields in quantized packets at specific locationsthrough the superconductor material.

The information processed by qubits is carried or transmitted in theform of microwave signals/photons in the range of microwave frequencies.The microwave signals are captured, processed, and analyzed to decipherthe quantum information encoded therein. A readout circuit is a circuitcoupled with the qubit to capture, read, and measure the quantum stateof the qubit. An output of the readout circuit is information usable bya q-processor to perform computations.

A superconducting qubit has two quantum states |0> and |1>. These twostates may be two energy states of atoms, for example, the ground (|g>)and first excited (|e>) state of a superconducting artificial atom(superconducting qubit). Other examples include spin-up and spin-down ofthe nuclear or electronic spins, two positions of a crystalline defect,and two states of a quantum dot. Since the system is of a quantumnature, any combination of the two states are allowed and valid.

Superconducting devices such as qubits are fabricated usingsuperconducting and semiconductor materials in known semiconductorfabrication techniques. A superconducting device generally uses one ormore layers of different materials to implement the device propertiesand function. A layer of material can be superconductive, conductive,semi-conductive, insulating, resistive, inductive, capacitive, or haveany number of other properties. Different layers of materials may haveto be formed using different methods, given the nature of the material,the shape, size or placement of the material, other materials adjacentto the material, and many other considerations.

The software tools used for designing semiconducting and superconductingdevices produce, manipulate, or otherwise work with an electrical layoutand device components on very small scales. Some of the components thatsuch a tool may manipulate may only measure few nanometers across whenformed in a suitable substrate.

A layout includes shapes whose shape and position are selected in thetool according to the device's objective. Once a design layout, alsoreferred to simply as a layout, has been finalized for a device or agroup of devices, the design is converted into a set of masks orreticles. A set of masks or reticles is one or more masks or reticles.During manufacture, a semiconductor wafer is exposed to light orradiation through a mask to form microscopic components comprising thestructures. This process is known as photolithography. A mask is usablefor manufacturing or printing the contents of the mask onto the wafer.During the photolithographic printing process, radiation is focusedthrough the mask and at certain desired intensity of the radiation. Thisintensity of the radiation combined with any materials that aredeposited using the radiation is commonly referred to as “dose”. Thefocus and the dosing of the radiation is controlled to achieve thedesired shape and electrical characteristics of structures on the wafer.

A fabrication process for a semiconducting or superconducting deviceincludes not only dosing but other methods of depositing and/or removingmaterials having various electrical and/or mechanical characteristics.For example, a conducting material may be deposited using a beam of ionsof that material; a hard insulator may be dissolved using a chemical oreroded using mechanical planning. These examples of operations in afabrication process are not intended to be limiting. From thisdisclosure, those of ordinary skill in the art will be able to conceivemany other operations in a fabrication process that is usable tofabricate a device according to the illustrative embodiments, and thesame are contemplated within the scope of the illustrative embodiments.

Superconducting devices are often planar, i.e., where the superconductorstructures are fabricated on one plane. A non-planar device is athree-dimensional (3D) device where some of the structures are formedabove or below a given plane of fabrication.

Quantum gates perform operations on qubits. Quantum gates are analogousto basic operations in classical computing, such as AND, OR, and NOTgates, and are often used as building blocks for more complex operationson qubits. Topological quantum computation is an approach to quantumcomputation in which quantum gates result from the braiding of anyons, aparticular type of topological quantum object. Devices that implementtopological quantum computation offer the possibility of longercoherence times, and hence greater fault tolerance, than conventionalquantum computing devices, with similar computational capabilities toconventional quantum computing devices.

One implementation of an anyon suitable for topological quantumcomputation is a Majorana quasiparticle, also called a Majorana zeromode (MZM) or Majorana fermion. Thus, topological quantum computinginvolves manipulating MZMs and measuring their states, and a Majoranafermion quantum computing device implements MZM manipulation and statemeasurement.

SUMMARY

The illustrative embodiments provide a quantum computing device. Anembodiment includes a device region on a superconductor layer above afirst surface of a semiconductor layer. An embodiment includes a sensingregion within the device region, the sensing region comprising a portionof the device region in which the superconductor layer has been removed.An embodiment includes a sensing region contact comprising a first metalcoupled to the first surface of the semiconductor layer within thesensing region. An embodiment includes a nanorod contact comprising thefirst metal coupled to the superconductor layer within the portion ofthe device region outside the sensing region. An embodiment includes atunnel junction gate comprising a second metal within the sensingregion, the tunnel junction gate disposed on a second surface of thesemiconductor layer An embodiment includes a chemical potential gatecomprising the second metal within a portion of the device regionoutside the sensing region, the chemical potential gate disposed on thesecond surface of the semiconductor layer.

An embodiment includes a method to fabricate a quantum computing device.An embodiment includes a fabrication system for fabricating the quantumcomputing device.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features believed characteristic of the invention are setforth in the appended claims. The invention itself, however, as well asa preferred mode of use, further objectives and advantages thereof, willbest be understood by reference to the following detailed description ofthe illustrative embodiments when read in conjunction with theaccompanying drawings, wherein:

FIG. 1 depicts a block diagram of a network of data processing systemsin which illustrative embodiments may be implemented;

FIG. 2 depicts a two-sided Majorana fermion quantum computing devicefabricated with ion implant methods in accordance with an illustrativeembodiment;

FIG. 3 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 4 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 5 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 6 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 7 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 8 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 9 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 10 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 11 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 12 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 13 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 14 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 15 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 16 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 17 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 18 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 19 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 20 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 21 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 22 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 23 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 24 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 25 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 26 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment;

FIG. 27 depicts a block diagram of an example configuration reached inthe fabrication of a Majorana fermion quantum computing device inaccordance with an illustrative embodiment; and

FIG. 28 depicts a flowchart of an example process for fabricating aMajorana fermion quantum computing device in accordance with anillustrative embodiment.

DETAILED DESCRIPTION

The illustrative embodiments recognize that, while devices thatimplement topological quantum computation are desirable, there aredifficulties in fabricating such devices. For Majorana fermion quantumcomputing devices to function correctly, films and interfaces betweendevice layers must be above a particularly high quality threshold, butconventional device processing techniques such as reactive-ion etching(RIE), cleaning processes, and air oxidation tend to damage films andlayer surfaces, reducing quality below that threshold. In addition, ifdielectric films are used to separate structures, trapped charges indielectric films can produce quasiparticles, resulting in uncontrolledelectron densities that can quench qubit coherence. Further, multiplestructures, including semiconductor and superconductor components,regions used to measure MZM state, gates, contacts, and wires must beintegrated into one device. Therefore, the illustrative embodimentsrecognize that there is an unmet need to fabricate Majorana fermionquantum computing devices using techniques that produce sufficientlyhigh quality films and surfaces, avoid damaging RIE and cleaningprocesses, and avoid using dielectric films. In addition, theillustrative embodiments recognize that the process flow used tofabricate Majorana fermion quantum computing devices should have as fewmasking steps as possible, for efficient fabrication. Further, theillustrative embodiments recognize that arranging device gates andcontacts on two sides of a device improves wiring routing among devices.

The illustrative embodiments used to describe the invention generallyaddress and solve the above-described problems or needs and otherrelated problems or needs by providing two-sided Majorana fermionquantum computing devices fabricated with ion implant methods. Theillustrative embodiments also provide a novel fabrication method forfabricating two-sided Majorana fermion quantum computing devicesfabricated with ion implant methods. The illustrative embodiments alsoprovide a system for fabricating two-sided Majorana fermion quantumcomputing devices fabricated with ion implant methods. In particular,the illustrative embodiments provide for growing semiconductor andsuperconductor structures in situ, using known epi processes for III-Vquantum wells, to generate both high quality films and interfacesbetween films. The illustrative embodiments provide for using low doseion implant to define circuit regions, thus avoiding damaging RIE andclean processes, and to alter film conductivities, thus avoiding the useof dielectric films. In addition, mild wet etch is used to removesuperconductor from needed regions, and mild lift off patterning is usedto form wiring structures.

With reference to the figures and in particular with reference to FIG.1, these figures are example diagrams of data processing environments inwhich illustrative embodiments may be implemented. FIG. 1 is only anexample and is not intended to assert or imply any limitation withregard to the environments in which different embodiments may beimplemented. A particular implementation may make many modifications tothe depicted environments based on the following description.

FIG. 1 depicts a block diagram of a network of data processing systemsin which illustrative embodiments may be implemented. Data processingenvironment 100 is a network of computers in which the illustrativeembodiments may be implemented. Data processing environment 100 includesnetwork 102. Network 102 is the medium used to provide communicationslinks between various devices and computers connected together withindata processing environment 100. Network 102 may include connections,such as wire, wireless communication links, or fiber optic cables.

Clients or servers are only example roles of certain data processingsystems connected to network 102 and are not intended to exclude otherconfigurations or roles for these data processing systems. Server 104and server 106 couple to network 102 along with storage unit 108.Software applications may execute on any computer in data processingenvironment 100. Clients 110, 112, and 114 are also coupled to network102. A data processing system, such as server 104 or 106, or client 110,112, or 114 may contain data and may have software applications orsoftware tools executing thereon.

Device 132 is an example of a mobile computing device. For example,device 132 can take the form of a smartphone, a tablet computer, alaptop computer, client 110 in a stationary or a portable form, awearable computing device, or any other suitable device. Any softwareapplication described as executing in another data processing system inFIG. 1 can be configured to execute in device 132 in a similar manner.Any data or information stored or produced in another data processingsystem in FIG. 1 can be configured to be stored or produced in device132 in a similar manner.

Application 105 implements an embodiment described herein. Fabricationsystem 107 is a software component of any suitable system forfabricating a quantum device. Generally, fabrication systems and theircorresponding software components for manufacturing superconductingdevices, including devices for quantum computing usage, are known.Application 105 provides instructions to such a known fabrication systemvia fabrication application 107 for causing the assembly of a noveltwo-sided Majorana fermion quantum computing device fabricated with ionimplant methods contemplated in the illustrative embodiments, in amanner described herein.

An embodiment provides for a two-sided Majorana fermion quantumcomputing device fabricated with ion implant methods in accordance withan illustrative embodiment. The device includes a superconductor layerabove a semiconductor layer, a sensing region, and a sensing regioncontact within the sensing region and a nanorod contact outside thesensing region, both disposed on a first surface of the device. Thedevice also includes a tunnel junction gate within the sensing regionand a chemical potential gate outside the sensing region, both disposedon a second surface of the device. The device is surrounded by anisolation region.

An embodiment provides for a novel design and fabrication method of atwo-sided Majorana fermion quantum computing device fabricated with ionimplant methods in accordance with an illustrative embodiment. In theembodiment, a design/fabrication system designs and fabricates atwo-sided Majorana fermion quantum computing device fabricated with ionimplant methods.

Another embodiment provides a fabrication method for a two-sidedMajorana fermion quantum computing device fabricated with ion implantmethods, such that the method can be implemented as a softwareapplication. The application implementing a fabrication methodembodiment can be configured to operate in conjunction with an existingsuperconducting fabrication system—such as a lithography system.

For the clarity of the description, and without implying any limitationthereto, the illustrative embodiments are described using an examplenumber of Majorana fermion manipulation and measurement structuresarranged on a substrate. An embodiment can be implemented with adifferent number of structures, different structure arrangements, asuperconducting device other than a qubit formed using the structures,or other types of quantum computing devices, or some combinationthereof, within the scope of the illustrative embodiments.

Furthermore, a simplified diagram of the example structures is used inthe figures and the illustrative embodiments. In an actual fabricationof a Majorana fermion quantum computing device, additional structuresthat are not shown or described herein, or structures different fromthose shown and described herein, may be present without departing thescope of the illustrative embodiments. Similarly, within the scope ofthe illustrative embodiments, a shown or described structure in theexample device may be fabricated differently to yield a similaroperation or result as described herein.

Differently shaded portions in the two-dimensional drawing of theexample structures, layers, and formations are intended to representdifferent structures, layers, materials, and formations in the examplefabrication, as described herein. The different structures, layers,materials, and formations may be fabricated using suitable materialsthat are known to those of ordinary skill in the art.

A specific shape, location, position, or dimension of a shape depictedherein is not intended to be limiting on the illustrative embodimentsunless such a characteristic is expressly described as a feature of anembodiment. The shape, location, position, dimension, numerosity, orsome combination thereof, are chosen only for the clarity of thedrawings and the description and may have been exaggerated, minimized,or otherwise changed from actual shape, location, position, or dimensionthat might be used in actual lithography to achieve an objectiveaccording to the illustrative embodiments.

Furthermore, the illustrative embodiments are described with respect toa specific actual or hypothetical superconducting device, e.g., a qubitthat is presently viable, only as an example. The steps described by thevarious illustrative embodiments can be adapted for fabricating avariety of quantum computing devices in a similar manner, and suchadaptations are contemplated within the scope of the illustrativeembodiments.

An embodiment when implemented in an application causes a fabricationprocess to perform certain steps as described herein. The steps of thefabrication process are depicted in the several figures. Not all stepsmay be necessary in a particular fabrication process. Some fabricationprocesses may implement the steps in different order, combine certainsteps, remove or replace certain steps, or perform some combination ofthese and other manipulations of steps, without departing the scope ofthe illustrative embodiments.

The illustrative embodiments are described with respect to certain typesof materials, electrical properties, thermal properties, structures,formations, shapes, layers orientations, directions, steps, operations,planes, dimensions, numerosity, data processing systems, environments,components, and applications only as examples. Any specificmanifestations of these and other similar artifacts are not intended tobe limiting to the invention. Any suitable manifestation of these andother similar artifacts can be selected within the scope of theillustrative embodiments.

The illustrative embodiments are described using specific designs,architectures, layouts, schematics, and tools only as examples and arenot limiting to the illustrative embodiments. The illustrativeembodiments may be used in conjunction with other comparable orsimilarly purposed designs, architectures, layouts, schematics, andtools.

The examples in this disclosure are used only for the clarity of thedescription and are not limiting to the illustrative embodiments. Anyadvantages listed herein are only examples and are not intended to belimiting to the illustrative embodiments. Additional or differentadvantages may be realized by specific illustrative embodiments.Furthermore, a particular illustrative embodiment may have some, all, ornone of the advantages listed above.

With reference to FIG. 2, this figure depicts a two-sided Majoranafermion quantum computing device fabricated with ion implant methods inaccordance with an illustrative embodiment.

In particular, FIG. 2 depicts top and cross section views of device 200.Device 200 is a Majorana fermion quantum computing device fabricatedwith ion implant methods in accordance with an illustrative embodiment.Device 200 includes at least two nanorod structures 230 and 232,configured as one superconducting island surrounded by isolation region240. Nanorod structures 230 and 232 are both connected to a sensingregion. In one embodiment, nanorod structures 230 and 232 aresubstantially parallel to each other, and connected to a sensing regionat one end of each of nanorod structures 230 and 232. In anotherembodiment, nanorod structures 230 and 232 are substantiallyperpendicular to each other. In another embodiment, nanorod structures230 and 232 meet at an angle. Each nanorod structure includes asemiconductor portion of semiconductor layer 340 with a surface coveredby protective layer 350 and a superconducting portion of superconductorlayer 410).

Each nanorod structure has dimensions appropriate to enable the nanowireto act as a one-dimensional topological superconductor, with a chemicalpotential and magnetic field adjusted so that the nanorod hosts an MZMat each end when the metal in the superconducting portions of nanorodstructures 230 and 232 is caused to become superconducting—e.g. byreducing the temperature of the metal to a specified cryogenictemperature—and device 200 is operational. In particular, layers 330 and350 assist in confining charge carriers inside layer 340, which acts asa type of quantum well. In one embodiment, each nanorod structure is 200nanometers wide and 1 micrometer long, although smaller dimensions anddifferent width-length ratios are also possible and contemplated withinthe scope of the illustrative embodiments.

Using MZMs in a quantum computing device requires the ability to performparity measurements of MZM pairs. The illustrative embodiments performMZM parity measurements using a quantum dot based measurement scheme. Inparticular, quantum dot 220, part of a sensing region of device 200, isa semiconducting wire that is connected to one end of each of nanorodstructures 230 and 232. Using tunnel junction gate 204 to controlamplitudes for electrons to tunnel between quantum dot 220 and the MZMsin nanorod structures 230 and 232, quantum dot 220 can be selectivelycoupled to nanorod structures 230 and 232. When MZM state is not beingmeasured, all couplings are turned off, leaving the MZM island and thequantum dot with fixed charges. In the decoupled state, environmentalnoise, which couples to charge, has no effect on the MZMs. Thus, unlessa measurement is in progress, noise cannot measure, and hence collapse,the qubit state. To measure MZM state, the tunnel junction gate isactivated, inducing an energy shift observable using for example,quantum dot charge.

Sensing region contact 202 is coupled to quantum dot 220 and is used tosense electron density in the quantum dot. Nanorod contacts 206 and 212are coupled to the superconductor portion of nanorod structure 230 andare used to route electrical current through the superconductor portionof nanorod structures, imparting superconductivity to the surface of thesemiconductor portion of nanorod structures to make device 200 function.Chemical potential gates 208 and 210 are used to adjust nanorod chemicalpotential so that the nanorod hosts an MZM at each end. Tunnel junctiongate 204 also includes a dielectric portion coupled to thesuperconductor portion and a metal portion coupled to dielectricportion, and is used to pinch off nanorod conductivity during deviceoperation. Together, sensing region contact 202, tunnel junction gate204, and quantum dot 220 comprise a sensing region of device 200.

With reference to FIG. 3, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 300 as described herein.Semiconductor layer 340 and protective layer 350 are the same assemiconductor layer 340 and protective layer 350 in FIG. 2.

Substrate 310 comprises a material, which when operating in a cryogenictemperature range, exhibits a Residual Resistance Ratio (RRR) of atleast 100, and a thermal conductivity of greater than a 1 W/(cm*K) at 4Kelvin. RRR is the ratio of the resistivity of a material at roomtemperature and at 0 K. Because 0 K cannot be reached in practice, anapproximation at 4 K is used. For example, substrate 310 may be formedusing sapphire, silicon, quartz, gallium arsenide (GaAs), fused silica,amorphous silicon, indium phosphide (InP), or diamond for operations inthe temperature range of 77 K to 0.01K. These examples of substratematerials are not intended to be limiting. From this disclosure those ofordinary skill in the art will be able to conceive of many othermaterials suitable for forming substrate 310 and the same arecontemplated within the scope of the illustrative embodiments.

An embodiment causes the fabrication system to epitaxially grow bufferlayer 320, an epitaxial semiconductor, on substrate 310. Material forbuffer layer 320 is selected based on the composition of substrate 310and protective layer 330. In one embodiment, buffer layer 320 is formedof indium aluminum arsenide (InAlAs), to match the crystal lattice ofadjacent protective layer 330, In one embodiment, buffer layer 320 has agradual change in composition from substrate 310 to protective layer 330to avoid creating crystal defects—e.g. dislocations—in protective layer330. In one embodiment, the gradual change in composition is a linearchange. For example, if substrate 310 comprises GaAs and protectivelayer 330 comprises InAs, growing a sufficiently high quality layer ofInAs directly on the GaAs of substrate 310 is difficult. Thus, bufferlayer 320 begins at substrate 310 with GaAs, and the gallium isgradually replaced with indium to eventually match the InAs ofprotective layer 330. These examples of materials are not intended to belimiting. From this disclosure those of ordinary skill in the art willbe able to conceive of many other materials suitable for forming bufferlayer 320 and the same are contemplated within the scope of theillustrative embodiments.

An embodiment causes the fabrication system to epitaxially growprotective layer 330, an epitaxial semiconductor, on buffer layer 320.Materials for protective layers 330 and 350 are selected based on thecomposition of semiconductor layer 340, to provide crystal quality abovea particular quality threshold. In an embodiment using InAs in aone-to-one ratio for semiconductor layer 340, indium gallium arsenide(InGaAs) using a 0.8 In to 1 Ga to 0.2 As ratio is used for protectivelayers 330 and 350. In an embodiment using indium gallium arsenide(InGaAs) using a 0.7 In to 1 Ga to 0.3 As ratio for semiconductor layer340, indium gallium arsenide (InGaAs) using a 0.53 In to 1 Ga to 0.47 Asratio or a 0.52 In to 1 Ga to 0.48 As ratio is used for protectivelayers 330 and 350. In an embodiment using InSb for semiconductor layer340, In0.80-0.90A10.1-0.2Sb (InAlSb using a 1 In to 0.8-0.9 Al to0.1-0.2 Sb ratio) is used for protective layers 330 and 350. In anembodiment using InP as a substrate, protective layer 330 is latticematched to the InP of substrate 310. However, protective layers 330 and350 need not be formed of the same material. In addition, protectivelayer 350 is not required. These examples of materials are not intendedto be limiting. From this disclosure those of ordinary skill in the artwill be able to conceive of many other materials suitable for formingprotective layers 330 and 350 and the same are contemplated within thescope of the illustrative embodiments. In one embodiment, protectivelayer 330 is approximately 4 nm thick, although a thicker or thinnerlayer is also possible and contemplated within the scope of theillustrative embodiments.

An embodiment causes the fabrication system to epitaxially growsemiconductor layer 340 on protective layer 330. In embodiments,semiconductor layer 340 is formed of indium arsenide (InAs) using aone-to-one In:As ratio, indium gallium arsenide (InGaAs) using a 0.7 Into 1 Ga to 0.3 As ratio, or indium antimony (InSb). These examples ofsubstrate materials are not intended to be limiting. From thisdisclosure those of ordinary skill in the art will be able to conceiveof many other materials suitable for forming substrate 310 and the sameare contemplated within the scope of the illustrative embodiments. Inone embodiment, semiconductor layer 340 is approximately 7 nm thick,although a thicker or thinner layer is also possible and contemplatedwithin the scope of the illustrative embodiments.

An embodiment causes the fabrication system to epitaxially growprotective layer 350, an epitaxial semiconductor, on semiconductor layer340. In one embodiment, protective layer 350 is approximately 5 nmthick, although a thicker or thinner layer is also possible andcontemplated within the scope of the illustrative embodiments.Protective layers 330 and 350 protect surfaces of semiconductor layer340 from damage during fabrication. A damaged portion of semiconductorlayer 340 could degrade device properties. Thus, if the risk of damageduring fabrication is sufficiently low, protective layer 350 may notnecessary over the quantum dot structure. In addition, protective layers330 and 350 need not be the same material.

With reference to FIG. 4, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 400 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,and protective layer 350 are the same as substrate 310, buffer layer320, protective layer 330, semiconductor layer 340, and protective layer350 in FIG. 3.

An embodiment causes the fabrication system to deposit superconductorlayer 410 on protective layer 350 (or semiconductor layer 340, ifprotective layer 350 is not used), using physical vapor deposition(PVD), for example using evaporation or spattering. Superconductor layer410 is formed of a material that is superconducting within a cryogenictemperature range of 77 K to 0.01K. Aluminum (Al), niobium, lead,tantalum nitride, titanium, titanium nitride, and vanadium arenon-limiting examples of suitable materials for superconductor layer410, although many other materials are suitable for formingsuperconductor layer 410 and the same are contemplated within the scopeof the illustrative embodiments. In embodiments, superconductor layer410 is between 5 and 50nm, and preferably between 20 and 30 nm, thick,although a thicker or thinner layer is also possible and contemplatedwithin the scope of the illustrative embodiments.

With reference to FIG. 5, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 500 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, and superconductor layer 410 are the same assubstrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, and superconductor layer 410 in FIG. 4.

An embodiment causes the fabrication system to deposit resist layer 510,formed in a resist pattern, on superconductor layer 410. The resistpattern protects nanorod regions 520 and 530 and sensing region 540 fromupcoming device processing steps. Resist layer 510 can be formed fromany resist material used in lithography.

The depiction of a resist layer formed in a resist pattern and thedescription of the lithography techniques should not be construed aslimiting on the manner of forming the structures described herein. Thedepicted pattern is merely a simplified and generalized example.Lithography of the depicted structures is possible in many ways. Forexample, lithography of the described structures is presentlyaccomplished by patterning a resist with photolithography (light) orebeam lithography (electron beam), developing the resist, then eithersubtracting deposited material from the openings in the resist, ordepositing material in the openings in the resist. The resist is removedat the end. Fabrication processes and technology is constantly changingand other methods of forming the described structures are within thecontemplations of the illustrative embodiments so long as the resultingstructures have the electrical, mechanical, thermal, and operatingcharacteristics as described herein.

With reference to FIG. 6, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 600 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, and resist layer 510 arethe same as substrate 310, buffer layer 320, protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,and resist layer 510 in FIG. 5.

An embodiment causes the fabrication system to perform an etchingprocess, removing portions of superconductor layer 410 and exposingprotective layer 350 in regions that are unprotected by resist layer510. The etching process also produces etch region 610, an undercutregion within superconductor layer 410 under resist layer 510. Theetching process is selected to minimize surface damage duringfabrication. In one embodiment, the etching process is a wet etchprocess, for example using tetramethylammonium hydroxide (TMAH).

With reference to FIG. 7, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 700 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, and resist layer 510 arethe same as substrate 310, buffer layer 320, protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,and resist layer 510 in FIG. 6.

An embodiment causes the fabrication system to perform an ion implantprocess. The ion implant process disrupts the crystal structure ofexposed portions of semiconductor layer 340, forming implant region 710.In implant region 710, semiconductor layer 340 is non-conductive, thusforming an isolation region surrounding the device being fabricated. Theion implant process uses ions of any material suitable for forming anisolation region. Some non-limiting examples of suitable ion implantmaterials include hydrogen, oxygen, helium, gallium, argon, and neon.Other ion implant materials are also possible and contemplated withinthe scope of the illustrative embodiments.

With reference to FIG. 8, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 800 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, resist layer 510, andimplant region 710 are the same as substrate 310, buffer layer 320,protective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, resist layer 510, and implant region 710 inFIG. 7.

An embodiment causes the fabrication system to deposit resist layer 810,formed in a resist pattern, on resist layer 510 and portions ofunderlying surfaces exposed through openings in resist layer 510. Theresist pattern protects areas other than resist opening 820 fromupcoming device processing steps. Resist layer 810 can be formed fromany resist material used in lithography, and can be the same or adifferent material from resist layer 510.

With reference to FIG. 9, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 900 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, resist layer 510,implant region 710, resist layer 810, and resist opening 820 are thesame as substrate 310, buffer layer 320, protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,resist layer 510, implant region 710, resist layer 810, and resistopening 820 in FIG. 8.

An embodiment causes the fabrication system to perform an etchingprocess, removing superconductor layer 410 to expose protective layer350 in regions that are unprotected by resist layer 810. The etchingprocess also produces etch region 910, an undercut region withinsuperconductor layer 410 under resist layers 510 and 810. The etchingprocess is selected to minimize surface damage during fabrication, andcan be the same or a different process as that used to formconfiguration 600. In one embodiment, the etching process is a wet etchprocess, for example using tetramethylammonium hydroxide (TMAH).

With reference to FIG. 10, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 1000 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, and implant region 710are the same as substrate 310, buffer layer 320, protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,and implant region 710 in FIG. 9.

An embodiment causes the fabrication system to perform a resist removalprocess, removing resist layers 510 and 810, exposing portions ofsuperconductor layer 410 and protective layer 350. An embodiment usesany resist removal process used in lithography. As a result, inconfiguration 1100, portions of protective layer 350 are exposed inareas at one side of superconductor layer 410.

With reference to FIG. 11, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 1100 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, and implant region 710are the same as substrate 310, buffer layer 320, protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,and implant region 710 in FIG. 10.

Configuration 1100 is a configuration that is optionally reachable fromconfiguration 700 in FIG. 7 using a suitably configured mask in resistlayer 510 in a lithographic process, omitting the fabrication stepsdescribed with reference to configurations 800 and 900. In configuration1100, portions of protective layer 350 are exposed in areas surroundingsuperconductor layer 410. Configurations 1000 and 1100 performsimilarly; however, configuration 1100 is preferred for its use of fewerprocess steps than configuration 1000.

With reference to FIG. 12, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 1200 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, and implant region 710are the same as substrate 310, buffer layer 320, protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,and implant region 710 in FIG. 11. Configuration 1200 is depicted as theresult of manipulating configuration 1000, but can also be the result ofmanipulating configuration 1100 instead.

An embodiment causes the fabrication system to deposit resist layer1210, which includes an opening that exposes region 1220, includingportions of protective layer 350 and superconductor layer 410. Region1220 is intended to become the sensing region of device 200. Resistlayer 1210 can be formed from any resist material used in lithography,and can be the same or a different material from resist layers 510 and810.

With reference to FIG. 13, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 1300 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, implant region 710, andresist layer 1210 are the same as substrate 310, buffer layer 320,protective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, and resist layer 1210 inFIG. 12.

An embodiment causes the fabrication system to perform an etchingprocess, removing superconductor layer 410 to expose protective layer350 in region 1310, including an undercut region within superconductorlayer 410 under resist layer 1210. The etching process is selected tominimize surface damage during fabrication, and can be the same or adifferent process as that used to form configuration 600. In oneembodiment, the etching process is a wet etch process, for example usingtetramethylammonium hydroxide (TMAH).

With reference to FIG. 14, this figure depicts a block diagram of anexample configuration reached in the fabrication of a Majorana fermionquantum computing device in accordance with an illustrative embodiment.Application 105 in FIG. 1 interacts with fabrication system 107 toproduce or manipulate configuration 1400 as described herein. Substrate310, buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, and implant region 710are the same as substrate 310, buffer layer 320, protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,and implant region 710 in FIG. 13.

An embodiment causes the fabrication system to perform a resist removalprocess, removing resist layer 1210, exposing portions of superconductorlayer 410 and protective layer 350. An embodiment uses any resistremoval process used in lithography. Optionally, the resist, etching,and resist removal steps described with reference to configurations 1200and 1300 can be combined with using a suitably configured mask in resistlayer 510 or 810 in a lithographic process.

With reference to FIG. 15, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 1500 as described herein.Substrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, and implantregion 710 are the same as substrate 310, buffer layer 320, protectivelayer 330, semiconductor layer 340, protective layer 350, superconductorlayer 410, and implant region 710 in FIG. 14.

An embodiment causes the fabrication system to deposit resist 1510 onconfiguration 1400, with openings at exposed regions 1520 and 1530.Resist 1510 can be formed from any resist material used in lithography,and can be the same or a different material from other resist layersdescribed herein.

With reference to FIG. 16, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 1600 as described herein.Substrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, implantregion 710, resist 1510, and exposed regions 1520 and 1530 are the sameas substrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, implantregion 710, resist 1510, and exposed regions 1520 and 1530 in FIG. 15.

An embodiment causes the fabrication system to form metal 1610 onportions of configuration 1500 exposed by openings in the resist layer.Metal 1610 is deposited using any lithographic process for metaldeposition. Metal 1610 comprises a material with high electrical andthermal conductivity (above a threshold RRR and above a thresholdthermal conductivity) in the cryogenic temperature range, for operationsin the temperature range of 77 K to 0.01K. Although a metal that issuperconducting in the cryogenic temperature range is preferred becausesuch a metal has little resistance to generate heat, anon-superconducting metal can also be used. Some non-limiting examplesof materials for metal 1610 are gold, palladium, vanadium, aluminum,lead, tin, platinum, niobium, tantalum, tantalum nitride, titanium, andtitanium nitride. These examples of layer materials are not intended tobe limiting. From this disclosure, those of ordinary skill in the artwill be able to conceive of many other materials suitable for formingmetal 1610 and the same are contemplated within the scope of theillustrative embodiments.

Metal 1610 on protective layer 350 forms sensing region contact 202.Metal 1610 on superconductor layer 410 forms nanorod contacts 206 and212.

With reference to FIG. 17, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 1700 as described herein.Substrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, implantregion 710, metal 1610, sensing region contact 202 and nanorod contacts206 and 212 are the same as substrate 310, buffer layer 320, protectivelayer 330, semiconductor layer 340, protective layer 350, superconductorlayer 410, implant region 710, metal 1610, sensing region contact 202and nanorod contacts 206 and 212 in FIG. 16.

An embodiment causes the fabrication system to perform a resist removalprocess, removing resist 1510 from configuration 1600 and exposingunderlying portions of configuration 1700. An embodiment uses any resistremoval process used in lithography.

With reference to FIG. 18, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 1800 as described herein.Substrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, implantregion 710, metal 1610, sensing region contact 202, and nanorod contacts206 and 212 are the same as substrate 310, buffer layer 320, protectivelayer 330, semiconductor layer 340, protective layer 350, superconductorlayer 410, implant region 710, metal 1610, sensing region contact 202,and nanorod contacts 206 and 212 in FIG. 17.

An embodiment causes the fabrication system to deposit encapsulationfilm 1810 on configuration 1700. Encapsulation film 1810 protectsstructures on a surface of configuration 1800 while further processingis performed on the opposite surface. Encapsulation film 1810 can beformed from any encapsulation film material used in lithography, forexample germanium, silicon germanium (SiGe) oxide, tungsten oxide, orgallium oxide. These examples of materials are not intended to belimiting. From this disclosure, those of ordinary skill in the art willbe able to conceive of many other materials suitable for formingencapsulation film 1810 and the same are contemplated within the scopeof the illustrative embodiments.

With reference to FIG. 19, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 1900 as described herein.Substrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, implantregion 710, metal 1610, sensing region contact 202, nanorod contacts 206and 212, and encapsulation film 1810 are the same as substrate 310,buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, implant region 710,metal 1610, sensing region contact 202, nanorod contacts 206 and 212,and encapsulation film 1810 in FIG. 18.

An embodiment causes the fabrication system to form carrier wafer 1910on encapsulation film 1810. Carrier wafer 1910 provides structuralsupport for the device while further processing is performed. Carrierwafer 1910 can be any suitable carrier wafer or substrate material asdescribed herein. These examples of carrier wafer and substratematerials are not intended to be limiting. From this disclosure, thoseof ordinary skill in the art will be able to conceive of many othermaterials suitable for forming carrier wafer 1910 and the same arecontemplated within the scope of the illustrative embodiments.

With reference to FIG. 20, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 2000 as described herein.Substrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, implantregion 710, metal 1610, sensing region contact 202, nanorod contacts 206and 212, encapsulation film 1810, and carrier wafer 1910 are the same assubstrate 310, buffer layer 320, protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, implantregion 710, metal 1610, sensing region contact 202, nanorod contacts 206and 212, encapsulation film 1810, and carrier wafer 1910 in FIG. 19.

An embodiment causes the fabrication system to remove substrate 310,exposing buffer layer 320 for further processing.

With reference to FIG. 21, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 2100 as described herein.Buffer layer 320, protective layer 330, semiconductor layer 340,protective layer 350, superconductor layer 410, implant region 710,metal 1610, sensing region contact 202, nanorod contacts 206 and 212,encapsulation film 1810, and carrier wafer 1910 are the same as bufferlayer 320, protective layer 330, semiconductor layer 340, protectivelayer 350, superconductor layer 410, implant region 710, metal 1610,sensing region contact 202, nanorod contacts 206 and 212, encapsulationfilm 1810, and carrier wafer 1910 in FIG. 20.

An embodiment causes the fabrication system to remove buffer layer 320,exposing protective layer 330 for further processing.

With reference to FIG. 22, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 2200 as described herein.Protective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, metal 1610, sensing regioncontact 202, nanorod contacts 206 and 212, encapsulation film 1810, andcarrier wafer 1910 are the same as protective layer 330, semiconductorlayer 340, protective layer 350, superconductor layer 410, implantregion 710, metal 1610, sensing region contact 202, nanorod contacts 206and 212, encapsulation film 1810, and carrier wafer 1910 in FIG. 21.Tunnel junction gate 204 and chemical potential gates 208 and 210 arethe same as tunnel junction gate 204 and chemical potential gates 208and 210 in FIG. 2.

An embodiment causes the fabrication system to form resist 2210 onnow-exposed protective layer 330, followed by forming metal 2220 onresist 2210 and exposed regions of protective layer 330. Resist 2210 canbe formed from any resist material used in lithography, and can be thesame or a different material from other resist layers described herein.Metal 2220 is deposited using any suitable metal deposition process, canbe formed from any metal material described herein, and can be the sameor a different material from other metal layers described herein. Metal2220 in the sensing region forms tunnel junction gate 204. Metal 2220outside the sensing region, in proximity to superconductor layer 410,forms chemical potential gates 208 and 210.

With reference to FIG. 23, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 2300 as described herein.Protective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, metal 1610, sensing regioncontact 202, nanorod contacts 206 and 212, encapsulation film 1810,carrier wafer 1910, metal 2220, tunnel junction gate 204, and chemicalpotential gates 208 and 210 are the same as protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,implant region 710, metal 1610, sensing region contact 202, nanorodcontacts 206 and 212, encapsulation film 1810, carrier wafer 1910, metal2220, tunnel junction gate 204, and chemical potential gates 208 and 210in FIG. 22.

An embodiment causes the fabrication system to perform a resist removalprocess, removing resist 2210 from configuration 2200. An embodimentuses any resist removal process used in lithography.

With reference to FIG. 24, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 2400 as described herein.Protective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, metal 1610, sensing regioncontact 202, nanorod contacts 206 and 212, encapsulation film 1810,carrier wafer 1910, metal 2220, tunnel junction gate 204, and chemicalpotential gates 208 and 210 are the same as protective layer 330,semiconductor layer 340, protective layer 350, superconductor layer 410,implant region 710, metal 1610, sensing region contact 202, nanorodcontacts 206 and 212, encapsulation film 1810, carrier wafer 1910, metal2220, tunnel junction gate 204, and chemical potential gates 208 and 210in FIG. 23.

An embodiment causes the fabrication system to form resist 2410 onexposed portions of implant region 710, protective layer 330, and tunneljunction gate 204, and chemical potential gates 208 and 210, withopenings exposing portions of implant region 710 outside active portionsof device 200. Resist 2210 can be formed from any resist material usedin lithography, and can be the same or a different material from otherresist layers described herein.

With reference to FIG. 25, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 2500 as described herein.Protective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, metal 1610, sensing regioncontact 202, nanorod contacts 206 and 212, encapsulation film 1810,carrier wafer 1910, metal 2220, tunnel junction gate 204, chemicalpotential gates 208 and 210, and resist 2410 are the same as protectivelayer 330, semiconductor layer 340, protective layer 350, superconductorlayer 410, implant region 710, metal 1610, sensing region contact 202,nanorod contacts 206 and 212, encapsulation film 1810, carrier wafer1910, metal 2220, tunnel junction gate 204, chemical potential gates 208and 210, and resist 2410 in FIG. 24.

An embodiment causes the fabrication system to perform an etchingprocess, removing exposed portions of implant region 710 to createexposed region 2510, allowing access to encapsulation film 1810. Theetching process can be the same or a different process as that describedelsewhere herein. In one embodiment, the etching process uses RIE.

With reference to FIG. 26, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 2600 as described herein.Protective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, metal 1610, sensing regioncontact 202, nanorod contacts 206 and 212, encapsulation film 1810,carrier wafer 1910, metal 2220, tunnel junction gate 204, chemicalpotential gates 208 and 210, and exposed region 2510 are the same asprotective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, metal 1610, sensing regioncontact 202, nanorod contacts 206 and 212, encapsulation film 1810,carrier wafer 1910, metal 2220, tunnel junction gate 204, chemicalpotential gates 208 and 210, and exposed region 2510 in FIG. 25.

An embodiment causes the fabrication system to form contact region 2610in some of exposed regions 2510, while leaving others of exposed regions2510 alone. Contact region 2610 provides electrical coupling to sensingregion contact 202, nanorod contacts 206 and 212, and other structureson one surface of device 200. Contact region 2610 is formed of anysuitable electrically conductive material, is deposited using anysuitable deposition process, and can be the same or a different materialfrom other metal materials described herein.

With reference to FIG. 27, this figure depicts a block diagram of anexample configuration reached in the fabrication of a two-sided Majoranafermion quantum computing device in accordance with an illustrativeembodiment. Application 105 in FIG. 1 interacts with fabrication system107 to produce or manipulate configuration 2700 as described herein.Protective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, metal 1610, sensing regioncontact 202, nanorod contacts 206 and 212, encapsulation film 1810,carrier wafer 1910, metal 2220, tunnel junction gate 204, chemicalpotential gates 208 and 210, and exposed region 2510 are the same asprotective layer 330, semiconductor layer 340, protective layer 350,superconductor layer 410, implant region 710, metal 1610, sensing regioncontact 202, nanorod contacts 206 and 212, encapsulation film 1810,carrier wafer 1910, metal 2220, tunnel junction gate 204, chemicalpotential gates 208 and 210, and exposed region 2510 in FIG. 25.

An embodiment causes the fabrication system to remove most ofencapsulation film 1810 through exposed regions 2510, leaving enoughencapsulation film 1810 in areas near superconductor layer 410 to act asa bonding layer with carrier wafer 1910. In embodiments, encapsulationfilm 1810 is removed with a wet process, for example using water or anorganic solvent, or using a mild wet etch or mild plasma etch process.Other removal methods for encapsulation film 1810 are also possible andcontemplated within the scope of the illustrative embodiments.Configuration 2700 is a completed form of device 200.

With reference to FIG. 28, this figure depicts a flowchart of an exampleprocess for fabricating a Majorana fermion quantum computing device inaccordance with an illustrative embodiment. In one or more embodiments,process 2800 is implemented in application 105, which causes afabrication system, such as fabrication system 107 in FIG. 1 to performthe operations described herein.

In block 2802, the application causes the fabrication system to, on asubstrate surface, form in succession a buffer layer, first protectivelayer, semiconductor layer, and superconductor layer. In block 2804, theapplication causes the fabrication system to form a first resist patterndefining a device region and a sensing region within the device regionon the superconductor layer. In block 2806, the application causes thefabrication system to use an etching process to remove thesuperconductor layer within the sensing region and expose a region ofthe underlying semiconductor layer outside the device region unprotectedby the first resist pattern. In block 2808, the application causes thefabrication system to implant the exposed region of the semiconductorlayer to form an isolation region surrounding the device region. Inblock 2810, the application causes the fabrication system to use anetching process to expose the sensing region and a portion of the deviceregion of the superconductor layer adjacent to the isolation region. Inblock 2812, the application causes the fabrication system to form asensing region gate within the sensing region and a nanorod contactwithin the portion of the device region outside the sensing region bydepositing a metal layer. In block 2814, the application causes thefabrication system to protect the sensing region contact, the nanorodcontact, and the superconductor layer with an encapsulation film and acarrier wafer. In block 2816, the application causes the fabricationsystem to, on an opposite surface of the semiconductor layer from thesensing region gate and the nanorod contact, form a tunnel junction gatewithin the sensing region and a chemical potential gate within theportion of the device region outside the sensing region by depositing asecond metal layer. In block 2818, the application causes thefabrication system to remove a portion of the encapsulation film.Process 2800 then ends.

Various embodiments of the present invention are described herein withreference to the related drawings. Alternative embodiments can bedevised without departing from the scope of this invention. Althoughvarious connections and positional relationships (e.g., top, bottom,over, below, adjacent, etc.) are set forth between elements in thefollowing description and in the drawings, persons skilled in the artwill recognize that many of the positional relationships describedherein are orientation-independent when the described functionality ismaintained even though the orientation is changed. These connectionsand/or positional relationships, unless specified otherwise, can bedirect or indirect, and the present invention is not intended to belimiting in this respect. Accordingly, a coupling of entities can referto either a direct or an indirect coupling, and a positionalrelationship between entities can be a direct or indirect positionalrelationship. As an example of an indirect positional relationship,references in the present description to forming layer “A” over layer“B” include situations in which one or more intermediate layers (e.g.,layer “C”) is between layer “A” and layer “B” as long as the relevantcharacteristics and functionalities of layer “A” and layer “B” are notsubstantially changed by the intermediate layer(s).

The following definitions and abbreviations are to be used for theinterpretation of the claims and the specification. As used herein, theterms “comprises,” “comprising,” “includes,” “including,” “has,”“having,” “contains” or “containing,” or any other variation thereof,are intended to cover a non-exclusive inclusion. For example, acomposition, a mixture, process, method, article, or apparatus thatcomprises a list of elements is not necessarily limited to only thoseelements but can include other elements not expressly listed or inherentto such composition, mixture, process, method, article, or apparatus.

Additionally, the term “illustrative” is used herein to mean “serving asan example, instance or illustration.” Any embodiment or designdescribed herein as “illustrative” is not necessarily to be construed aspreferred or advantageous over other embodiments or designs. The terms“at least one” and “one or more” are understood to include any integernumber greater than or equal to one, i.e. one, two, three, four, etc.The terms “a plurality” are understood to include any integer numbergreater than or equal to two, i.e. two, three, four, five, etc. The term“connection” can include an indirect “connection” and a direct“connection.”

References in the specification to “one embodiment,” “an embodiment,”“an example embodiment,” etc., indicate that the embodiment describedcan include a particular feature, structure, or characteristic, butevery embodiment may or may not include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to affect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

The terms “about,” “substantially,” “approximately,” and variationsthereof, are intended to include the degree of error associated withmeasurement of the particular quantity based upon the equipmentavailable at the time of filing the application. For example, “about”can include a range of ±8% or 5%, or 2% of a given value.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdescribed herein.

What is claimed is:
 1. A quantum computing device, comprising: a deviceregion located on a superconductor layer above a first surface of asemiconductor layer; a sensing region located within the device region,the sensing region comprising a portion of the device region includingno superconductor layer; a sensing region contact comprising a firstmetal coupled to the first surface of the semiconductor layer within thesensing region; a nanorod contact comprising the first metal coupled tothe superconductor layer within the portion of the device region outsidethe sensing region; a tunnel junction gate comprising a second metalwithin the sensing region, the tunnel junction gate disposed on a secondsurface of the semiconductor layer; and a chemical potential gatecomprising the second metal within a portion of the device regionoutside the sensing region, the chemical potential gate disposed on thesecond surface of the semiconductor layer.
 2. The quantum computingdevice of claim 1, wherein the first device region comprises a firstnanorod region, a second nanorod region substantially parallel to thefirst nanorod region, and the sensing region, the sensing regionconnecting the first nanorod region and the second nanorod region. 3.The quantum computing device of claim 1, further comprising: a bufferlayer formed on a first surface of a substrate; a first protective layerformed below the second surface of the semiconductor layer; and thesemiconductor layer formed on the first protective layer
 4. The quantumcomputing device of claim 3, wherein the buffer layer comprises indiumaluminum arsenide.
 5. The quantum computing device of claim 3, whereinthe first protective layer comprises indium gallium arsenide.
 6. Thequantum computing device of claim 1, wherein the superconductor layercomprises aluminum.
 7. The quantum computing device of claim 1, furthercomprising: a second protective layer formed between the first surfaceof the semiconductor layer and the superconductor layer.
 8. The quantumcomputing device of claim 1, further comprising: an isolation regionsurrounding the device region, the isolation region comprising a regionin which the superconductor layer has been removed and the semiconductorlayer implanted
 9. A computer-implemented method to fabricate a quantumcomputing device, the method comprising: forming, on a superconductorlayer, a first resist pattern defining a device region and a sensingregion within the device region; removing, using an etching process, thesuperconductor layer within the sensing region, the etching exposing aregion of a first surface of an underlying semiconductor layer outsidethe device region unprotected by the first resist pattern; implantingthe exposed region of the first surface of the semiconductor layer, theimplanting forming an isolation region surrounding the device region;exposing, using an etching process subsequent to the implanting, thesensing region and a portion of the device region of the superconductorlayer adjacent to the isolation region; forming a sensing region contactby coupling the first surface of the semiconductor layer with a firstmetal layer; forming a nanorod contact using the first metal coupled tothe superconductor layer within the portion of the device region outsidethe sensing region; and forming, by depositing a second metal layer on asecond surface of the semiconductor layer within the sensing region, atunnel junction gate.
 10. The computer-implemented method of claim 9,wherein the first device region comprises a first nanorod region, asecond nanorod region substantially parallel to the first nanorodregion, and the sensing region, the sensing region connecting the firstnanorod region and the second nanorod region.
 11. Thecomputer-implemented method of claim 9, further comprising: forming, ona first surface of a substrate, a buffer layer; forming, on the bufferlayer, a first protective layer; forming, on a first protective layer,the semiconductor layer; and forming, on the first surface of thesemiconductor layer, the superconductor layer.
 12. Thecomputer-implemented method of claim 11, wherein the buffer layercomprises indium aluminum arsenide.
 13. The computer-implemented methodof claim 11, wherein the first protective layer comprises indium galliumarsenide.
 14. The computer-implemented method of claim 9, wherein thesuperconductor layer comprises aluminum.
 15. The computer-implementedmethod of claim 9, further comprising: forming, between the firstsurface of the semiconductor layer and the superconductor layer, asecond protective layer.
 16. The computer-implemented method of claim 9,further comprising: removing, prior to depositing the first metal layer,the first resist pattern.
 17. The computer-implemented method of claim9, wherein depositing the first metal layer is performed in regionsdefined by a second resist pattern.
 18. The computer-implemented methodof claim 9, further comprising, prior to depositing the second metallayer: protecting the sensing region contact, the nanorod contact, andthe superconductor layer using an encapsulation film; and depositing,above the encapsulation film, a carrier wafer.
 19. Thecomputer-implemented method of claim 9, further comprising forming, bydepositing the second metal layer on the second surface of thesemiconductor layer.
 20. A superconductor fabrication system comprisinga lithography component, the superconductor fabrication system whenoperated on at least one die to fabricate a quantum computing deviceperforming operations comprising: forming, on a superconductor layer, afirst resist pattern defining a device region and a sensing regionwithin the device region; removing, using an etching process, thesuperconductor layer within the sensing region, the etching exposing aregion of a first surface of an underlying semiconductor layer outsidethe device region unprotected by the first resist pattern; implantingthe exposed region of the first surface of the semiconductor layer, theimplanting forming an isolation region surrounding the device region;exposing, using an etching process subsequent to the implanting, thesensing region and a portion of the device region of the superconductorlayer adjacent to the isolation region; forming a sensing region contactby coupling the first surface of the semiconductor layer with a firstmetal layer; forming a nanorod contact using the first metal coupled tothe superconductor layer within the portion of the device region outsidethe sensing region; and forming, by depositing a second metal layer on asecond surface of the semiconductor layer within the sensing region, atunnel junction gate.